Joint International Master · Erasmus Mundus

Become an expert in tomorrow’s technology

Study in the leading technical institutions of three European countries and turn your engineering degree into a global career in semiconductors, smart systems and emerging technologies.

Admission →Requirements

120 ECTSJoint master

3 countriesFinland, Norway and Hungary

4 semestersFull mobility

Applications openIntake Autumn 2027

10 JanuaryScholarship deadline

15 AprilEU/EEA self-funded deadline

How to apply

One programme, full value chain

From semiconductor physics to real-world systems

SSI² bridges disciplines often taught separately, with cleanroom work, design environments, testing and industry-linked projects.

Design and modelling

Integrated circuits, mixed-signal design, system-on-chip engineering, AI and advanced modelling.

Explore curriculum →

Fabrication and integration

Microfabrication, cleanroom processing, sensors, packaging and heterogeneous integration.

Learn more →

Innovation and impact

Entrepreneurship, sustainability and the needs of Europe’s semiconductor ecosystem.

Discover careers →

Study facts

StartAutumn 2027

Length4 semesters · 120 ECTS

LanguageEnglish

Coordinating campusVestfold, Norway

TeachingOn and off campus

CohortUp to 30 students

Application code7191

Please note. The Erasmus Mundus programme is subject to the signing of the Grant Agreement, expected in mid-November 2026. All applicants will be informed if the programme cannot proceed.

What you will be able to do

The learning outcomes of the joint degree, set out in full in the curriculum.

Knowledge

Advanced understanding of semiconductor chips on heterogeneous platforms: design, modelling, fabrication, testing and integration into systems for healthcare, transport, communication and security.

See the curriculum →

Skills

Break down complex problems, choose suitable tools and methods, work critically with sources, and carry out an independent research or development project under supervision.

Master’s thesis →

Competence

Communicate clearly, reflect on ethical and sustainability effects, and understand the semiconductor supply chain.

Where graduates work →

Partner universities

Three universities, three countries

One joint degree with mobility between leading technical universities.

Aalto University

Finland · Semester 1

Aalto University

Semiconductor physics, AI and innovation at OtaNano.

University of South-Eastern Norway

Norway · Semester 2

University of South-Eastern Norway

Cleanroom processing and integration at MST-Lab.

Budapest University of Technology and Economics

Hungary · Semester 3

Budapest University of Technology and Economics

Chip design and system engineering.

European mobility

One connected experience

Move through Finland, Norway and Hungary, then complete your master project with an academic or industrial partner.

SEMESTER 01

Aalto

Finland

Physics, AI and innovation.

SEMESTER 02

USN

Norway

Cleanroom processing and integration.

SEMESTER 03

BME

Hungary

Chip design and system engineering.

SEMESTER 04

Master project

Academia or industry

A focused research or development project.

Explore the mobility scheme →

One route across Europe

Helsinki, Vestfold and Budapest: three campuses, three research environments, one continuous programme. In the fourth semester you do your master project with the consortium partners or with an industrial or academic partner.

The associated partners EPoSS and NCE-MNT bring company visits, guest speakers and opportunities for an industrial master project.

Explore the mobility scheme →

What are Semiconductor Chips Integration?

Semiconductor chip integration is the science and engineering of combining semiconductor devices, sensors, electronics and intelligent software into smart systems that power the technologies of the future.

What is SSI²?

A two-year (120 ECTS) Joint Master Programme with full student mobility between three partner institutions with leading expertise in Smart Systems and Microsystems Technology.

Key dates

Plan your application

Applications are open now. Check the official page for final terms.

Scholarship and non-EU/EEA deadline10 January

EU/EEA self-funded deadline15 April

Programme startsAutumn 2027

Ready to shape semiconductor innovation?

Check the requirements and apply for Autumn 2027.

How to apply →