A two-year, 120 ECTS joint master’s programme across Finland, Norway and Hungary, combining scientific depth, laboratory training and innovation.
Programme Description
SSI² is a joint master’s degree offered by the University of South-Eastern Norway (USN), Aalto University in Finland and Budapest University of Technology and Economics (BME). It bridges chip design, semiconductor processing, packaging, testing and system-level integration, so that you learn to take an idea from device physics to a working smart system.
Three taught semesters, one at each university, followed by the master project. The complementary expertise of the three institutions means you learn each part of the chip value chain where it is taught best.
Semester 1 · Aalto, Finland
Semiconductor physics, artificial intelligence, sustainable and reliable electronics, innovation and entrepreneurship.
Semester 2 · USN, Norway
Microfabrication, cleanroom processing, sensors and their integration with semiconductor devices, digital twins, materials and device characterisation.
Semester 3 · BME, Hungary
Semiconductor device design, integrated and mixed-signal chip design, system-level engineering, power semiconductors and advanced modelling tools.
Semester 4 · Master project
An individual project shared between consortium partners, or carried out with an industrial or academic partner.
Knowledge
Advanced understanding of semiconductor chips on heterogeneous platforms, their design, modelling, fabrication and testing, and their integration into systems for healthcare, transport, communication and security.
Skills
Break down complex problems, choose suitable tools and methods, work critically with sources, and carry out an independent research or development project under supervision.
Competence
Communicate clearly, reflect on ethical and sustainability effects, understand the semiconductor supply chain, and work in multinational teams.
Entrepreneurship
Apply innovation and business-creation thinking to turn technology into value for society.
By graduation you will be able to meet the following outcomes, set by the consortium for the whole joint degree.
Knowledge · 6 outcomes
Advanced knowledge of semiconductor chips across heterogeneous technology platforms: sensors, actuators, transducers, analogue and mixed-signal processing, and digital microelectronics.
In-depth theory and practice in the design, modelling, fabrication and testing of chips and integrated systems.
Integrating diverse chips into larger systems for healthcare, transport, communication, security and environmental surveillance.
Thorough knowledge of current research and methods, and how to apply new results.
Intermediate knowledge of innovation, entrepreneurship and business creation.
Analysing engineering problems through the role of chips and systems in technological change, society and sustainable development.
Skills · 6 outcomes
Break complex problems into subtasks, select methods and produce innovative solutions, even in new areas.
Analyse sources critically and use them to structure scientific arguments.
Independently assess and select tools, methods, models, calculations and solutions.
Apply your knowledge to help establish and develop businesses.
Carry out an independent, limited research or development project under supervision, following research ethics.
Explain European society and political systems, using Finland, Norway and Hungary as examples.
Competence · 6 outcomes
Communicate clearly in writing and orally to different audiences.
Reflect on the ethical, societal and sustainability effects of your work.
Understand the semiconductor supply chain, the socio-economics of chip manufacturing and its impact on the EU’s circular-economy goals.
Work in multidisciplinary, multinational teams: plan, delegate and coordinate.
Bring an international perspective to the profession and take part in international projects and networks.
Contribute to new thinking and innovation, and understand how your work creates value for society.
Examination and Grading
Each course is assessed according to its official course plan, which also lists the reading list. Examinations are covered by the programme participation costs. Admission itself refers to the ECTS grading scale, so grades are expressed in that system.
Course-specific assessment forms are published in the official course plans for the 2027 autumn study plan.
Hands-on training runs through the whole programme: laboratory exercises, industry projects, company visits, guest speakers, summer internships and the Winter and Summer Schools. Associated industrial clusters make it possible to visit relevant companies and even take your master project in industry.
Winter School: present your Design Lab project to academic and industry partners and receive feedback.
Summer School: meet current students and alumni before the third semester.
Winter School · image: ssi-master.eu
Master’s Thesis
The fourth semester is the master project, divided between the consortium partners or carried out with industrial or academic partners, so you can specialise in the area you care most about. You will plan and complete an independent project under supervision, following the norms of research ethics.
For Erasmus Mundus scholarship holders, the scholarship supports thesis preparation and the thesis defence as well.
Summer School · image: ssi-master.eu
Degree awarded
Graduates are awarded the Joint International Master in Semiconductor ChipS Integration and Innovation by the consortium universities (120 ECTS). The degree is a strong starting point for doctoral studies: in earlier joint masters from this consortium, around half of the graduates continued to a PhD.
Programme Quality
SSI² builds on the consortium’s earlier joint masters (SSI+ 2017–2020 and SSIs), delivered by the same three universities. Industrial clusters act as associated partners and give feedback on academic quality and on how competence needs in the semiconductor sector are changing.
The Erasmus Mundus programme is subject to the signing of the Grant Agreement, expected in mid-November 2026. All applicants will be informed if the programme cannot proceed.
Student agreement
Coming soon
Enrolled students sign an agreement with the consortium that covers rights, duties and mobility. The template will be published here.
What is SSI²?
SSI² is a two-year (120 ECTS) Erasmus Mundus Joint Master Programme, with full student mobility between three partner institutions with leading expertise in Smart Systems and Microsystems Technology. A maximum of 30 students are admitted each year.
It suits students with a bachelor’s degree in electrical engineering, electronics, computer engineering, physics, materials science, mechanical or biomedical engineering, or a closely related field.
Image: ssi-master.eu
Why choose SSI²?
From artificial intelligence and smart healthcare to autonomous vehicles and renewable energy, semiconductor technologies drive the innovations that shape our world. SSI² lets you study at three leading European universities, combining academic excellence, hands-on laboratory training, industry collaboration and international mobility.
Join a diverse cohort and build an international professional network.
Learn from internationally recognised researchers and industry experts.
Gain technical, entrepreneurial and intercultural skills that employers look for.
Image: ssi-master.eu
What are Semiconductor Chips Integration?
Semiconductor chip integration is the science and engineering of combining semiconductor devices, sensors, electronics and intelligent software into smart systems that power the technologies of the future. Smart systems are miniaturised systems that combine data processing with multi-modal sensing, actuation and communication.
